Cũng trong khuôn khổ triển lãm MWC 2012, hãng chíp Broadcom đã giới thiệu đến các đối tác của mình dòng chíp xử lý SoCs mới tinh chỉnh phù hợp với hệ điều hành Android 4 Ice Cream Sandwich tương thích cho bộ xử lý 1 nhân hoặc 2 nhân ARM Cortex A9s được sản xuất với công nghệ 40-nanometer. Hãng Broadcom cũng đã giới thiệu những bộ xử lý tích hợp của dòng chíp xử lý này bao gồm BCM21654G với lõi đơn 1GHz, tích hợp kết nối mạng HSPA 7.2 Mbps và tương thích chat video VGA. 2 bộ xử lý 2 nhân BCM28145 và BCM28155 có tốc độ 1.3 GHz cũng được tích hợp kết nối mạng HSPA+ 21 Mbps, hỗ trợ xem video chuẩn HD 720p và 1080p tương ứng.

Tất cả bộ xử lý 2 nhân của dòng chíp này điều được tích hợp "videocore" chíp thứ 3 tiêu thụ năng lượng thấp để phát lại video mà không cần chiếm tài nguyên của bộ xử lý chính, chíp ảnh Image Signal Processor hỗ trợ máy ảnh lên đến 42 megapixel. Ngoài ra thì Broadcom còn cung cấp các tùy chọn cho những đối tác với khả năng tích hợp thêm hệ thống định vị GPS / Glonass, cảm biến gần NFC, hỗ trợ 2 SIM...

Broadcom Introduces New Platforms Optimized for Android 'Ice Cream Sandwich' Smartphones

BARCELONA, Feb. 27, 2012 /PRNewswire/ -- Mobile World Congress --

Broadcom Corporation (NASDAQ: BRCM), a global innovation leader in semiconductor solutions for wired and wireless communications, today announced three smartphone platforms optimized to provide superior native support for the rich and immersive experience of the Android 4.0 "Ice Cream Sandwich" operating system (OS). Broadcom's new platforms provide powerful graphics, imaging, and application processing capabilities required to deliver the extensive benefits of the new OS. Visit Broadcom @ Mobile World Congress for more news from the show.

Smartphones have become the primary communications and computing devices that consumers use, with ABI Research forecasting that smartphones priced below $299.00 (wholesale) will see cumulative shipments of 3.8 billion units from 2012 to 2017. The enhanced graphical interface, expansive video and imaging capabilities, and rich user experiences of Android 4.0 will help fuel this trend, necessitating platform solutions that effectively balance graphical and image processing, HD video capabilities, and low power consumption for a satisfying smartphone experience.

Broadcom's new family of 3G platforms will enable handset OEMs to affordably deliver a premium Android 4.0 user experience across multiple smartphone product tiers. The Broadcom® BCM21654G features a 1 GHz ARM Cortex A9 processor, an integrated 7.2/5.8 Mbps HSPA modem and low-power VGA video support. The BCM28145 and BCM28155 include dual ARM Cortex A9 cores up to 1.3 GHz, 21/5.8 Mbps HSPA+ modems and HD 720p and 1080p, video respectively. All three chips were developed in an advanced, low power 40 nanometer process technology and are complemented by radio frequency (RF), power management unit (PMU) and an advanced connectivity suite for a complete system solution.

All three platforms are sampling to customers and expected to be in production in the second half of 2012.

Platform Highlights:

Optimized for Superior Android 4.0 ICS Smartphones:
Broadcom's industry-leading VideoCore technology offers a 'third processing core' to offload the application processor, enriching the Ice Cream Sandwich user experience with the industry's lowest power HD playback and camcorder capabilities up to 1080p.

Low latency memory and bus architecture boosts overall system performance for a highly responsive user interface.

Highest quality imaging is provided by Broadcom's latest Image Signal Processor (ISP) that supports cameras up to 42 megapixels, with very low light capabilities and wide dynamic range for the sharpest images.

Processor Options:

BCM28145 and BCM28155:
Dual ARM Cortex A9 cores at up to 1.3 GHz frequencies with VideoCore offload engine that provides twice the performance at half the power of comparable solutions.
An integrated HSPA+ release-8, category-14 modem supports 21 Megabits per second (Mbps) of downstream connectivity, 5.8 Mbps upstream, and Class 33 EDGE support for greater flexibility and worldwide roaming.

ARM Cortex A9 processing at 1GHz for superior applications processing and advanced user interface support.
An integrated 3G HSPA modem that supports 7.2 Megabits per second (Mbps) of downstream connectivity, 5.8 Mbps upstream, and Class 33 EDGE.

Advanced Platform Features:
BCM4334 combo chip provides Bluetooth 4.0 and concurrent dual-band Wi-Fi connectivity that enables simultaneous Internet connectivity and support for advanced features like Wi-Fi Direct and Wi-Fi Display.

BCM47511 GNSS solution supports both GPS and GLONASS constellations for more accurate positioning and faster Time to First Fix (TTFF).

BCM20792 low-power NFC chip supports multiple secure elements for mobile payments and innovative simplified connectivity applications.

Multimode, multiband 3G/2G radio and highly efficient power management chips
Broadcom InConcert® technology minimizes radio interference among the various technologies within the connectivity sub-system for a more satisfying user experience.

3G/2G dual-SIM capabilities with lowest overall power in standby and active modes allow consumers to use the same handset for two different phone lines, enabling applications such as access to work and personal cellular calls with one handset.

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